Publication result detail

Compatibility of through-hole technology devices with low-temperature co-fired ceramic substrate

KLÍMA, M.; PSOTA, B.; SZENDIUCH, I.

Original Title

Compatibility of through-hole technology devices with low-temperature co-fired ceramic substrate

English Title

Compatibility of through-hole technology devices with low-temperature co-fired ceramic substrate

Type

Peer-reviewed article not indexed in WoS or Scopus

Original Abstract

The article is focused on usage of the through-hole technology (THT) devices on low-temperature co-fired ceramic (LTCC) substrate. This usage is not common, therefore the main aim of this work is finding out the compatibility between LTCC substrate and a structure of device's lead, solder and thick-film paste. Two arrangements of through-hole metallization were used - printing and hole-filling. The most important results are establishment of reliable assembly process and thermal stress strength for finding the possibility of high temperature application. This is found out by ANSYS software simulation and temperature cycling. Defects caused by temperature cycling were studied optically using micro-cuts.

English abstract

The article is focused on usage of the through-hole technology (THT) devices on low-temperature co-fired ceramic (LTCC) substrate. This usage is not common, therefore the main aim of this work is finding out the compatibility between LTCC substrate and a structure of device's lead, solder and thick-film paste. Two arrangements of through-hole metallization were used - printing and hole-filling. The most important results are establishment of reliable assembly process and thermal stress strength for finding the possibility of high temperature application. This is found out by ANSYS software simulation and temperature cycling. Defects caused by temperature cycling were studied optically using micro-cuts.

Keywords

LTCC, THT, device, joint, reliability.

Key words in English

LTCC, THT, device, joint, reliability.

Authors

KLÍMA, M.; PSOTA, B.; SZENDIUCH, I.

RIV year

2014

Released

12.05.2013

Location

Rumunsko

ISBN

2161-2528

Periodical

Conference proceedings (International Spring Seminar on Electronics Technology)

Volume

36

Number

2013

State

United States of America

Pages from

127

Pages to

131

Pages count

5

BibTex

@article{BUT102803,
  author="Martin {Klíma} and Boleslav {Psota} and Ivan {Szendiuch}",
  title="Compatibility of through-hole technology devices with low-temperature co-fired ceramic substrate",
  journal="Conference proceedings (International Spring Seminar on Electronics Technology)",
  year="2013",
  volume="36",
  number="2013",
  pages="127--131",
  doi="10.1109/ISSE.2013.6648228",
  issn="2161-2528"
}