Publication result detail

Study of Atmosphere Influence on BGA Solder Balls Process

OTÁHAL, A.; SZENDIUCH, I.

Original Title

Study of Atmosphere Influence on BGA Solder Balls Process

English Title

Study of Atmosphere Influence on BGA Solder Balls Process

Type

Peer-reviewed article not indexed in WoS or Scopus

Original Abstract

This article deals with the influence of different atmosphere (normal, vapor, nitrogen) on some mechanical parameters, as shear strength, for BGA solder balls (Sn63Pb37, SAC305). There are also micro-sections of solder balls studied. Main objective of this work is to establish the optimal and necessary concentration of nitrogen for each application.

English abstract

This article deals with the influence of different atmosphere (normal, vapor, nitrogen) on some mechanical parameters, as shear strength, for BGA solder balls (Sn63Pb37, SAC305). There are also micro-sections of solder balls studied. Main objective of this work is to establish the optimal and necessary concentration of nitrogen for each application.

Keywords

shear strength, solder ball, reflow, vapor soldering, nitrogen atmosphere

Key words in English

shear strength, solder ball, reflow, vapor soldering, nitrogen atmosphere

Authors

OTÁHAL, A.; SZENDIUCH, I.

RIV year

2014

Released

26.06.2013

Publisher

UAB

Location

Alba Iiulia

ISBN

2161-2528

Periodical

Conference proceedings (International Spring Seminar on Electronics Technology)

Volume

36

Number

2013

State

United States of America

Pages from

121

Pages to

126

Pages count

6

BibTex

@article{BUT100913,
  author="Alexandr {Otáhal} and Ivan {Szendiuch}",
  title="Study of Atmosphere Influence on BGA Solder Balls Process",
  journal="Conference proceedings (International Spring Seminar on Electronics Technology)",
  year="2013",
  volume="36",
  number="2013",
  pages="121--126",
  issn="2161-2528"
}