Applied result detail

Zařízení pro hromadné osazení pájecích kuliček BGA

NICÁK, M.; BOBEK, J.

Original Title

Zařízení pro hromadné osazení pájecích kuliček BGA

English Title

Device for BGA solder balls montage

Type

Functioning sample

Abstract

Zarizeni slouzi k manipulaci s pajecimi kulickami a umoznuje jejich hromadne osazeni na BGA matrici do tavidla nebo pajeci pasty. Zarizeni bylo zkonstruovano jako doplnkovy modul k opravarenske stanici Fritsch Mikroplacer.

Abstract in English

Device is used for manipulation and deposition (montage) of BGA type solder balls into solder paste or flux. It was designed as upgrade module for BGA rework station Fritsch Mikroplacer.

Keywords

BGA, solder balls, montage, package

Key words in English

BGA, solder balls, montage, package

Location

Technická 10 Lab. 0.64

Possibilities of use

only the provider uses the result

Licence fee

In order to use the result by another entity, it is always necessary to acquire a license

www

http://www.umel.feec.vutbr.cz/vyzkum/vysledky/funkcni-vzorky/nicak-fv-rameno.pdf