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Project detail
Duration: 1.2.2023 — 30.4.2026
Funding resources
Ministerstvo školství, mládeže a tělovýchovy ČR - Chips Joint Undertaking
Evropská unie - HORIZON EUROPE
On the project
Listen2Future will boost the potential of piezoelectric acoustic transducers to provide new solutions in the key application areas of Health & Wellbeing and Digital Industry & Energy. Acoustic transducer solutions and the key underlying technologies are addressing many of the challenges in emerging applications towards a more digitalized society. Indeed, growing demand for MEMS-based acoustic transducers (microphones, ultrasonic transducers) in medical and industrial devices is creating a new high demand for miniaturized low power sensors. In combination with an intelligent signal processing system, algorithms and customized packaging, these technologies will be the key to achieve performant, low power consuming, miniaturized and cost-saving systems. The demonstrators will address 14 use-cases in Listen 2Future with their benchmark in the low power consumption, small size and low cost to open the door for disruptive acoustic applications. Major impact on quality of live for humans as well as on industrial and medical appliances can be expected. The European position in acoustic sensors will be therefore strengthened by new piezoelectric materials and technologies with the capability to outperform the existing ones that are based on capacitive MEMS technologies. This will contribute to reinforcing the Union's strategic autonomy in electronic components and systems to support future needs of vertical industries and the economy at large. The growth of the microphone market (8 -> 14 bio. units in 5 years) and the growth of the Ultrasound sensing modules market (500 mio -> 800 mio in 3 years) should be predominantly covered with acoustic sensors made in Europe. The double transition of European Union toward digital and greener society there poses a high demand for reliable and secure data. Our integral acoustic sensor solutions are listening to these needs and mapping the acoustic senses and perceptions into Society 5.0. ACKNOWLEDGMENT: Listen2Future is supported by the Chips Joint Undertaking and its members, including the top-up funding by National Authorities under Grant Agreement 101096884. Funded by the European Union. Views and opinions expressed are however those of the author(s) only and do not necessarily reflect those of the European Union or the granting authority. Neither the European Union nor the granting authority can be held responsible for them.
Keywords acoustic MEMS transducers, hardware accelerators, AI powered algorithms, application demonstrators
Mark
101096884/9A22005
Default language
English
People responsible
Havránek Zdeněk, Ing., Ph.D. - principal person responsibleBeneš Petr, doc. Ing., Ph.D. - fellow researcherKlusáček Stanislav, Ing., Ph.D. - fellow researcher
Units
Cybernetics and Robotics- responsible department (22.4.2022 - not assigned)Cybernetics and Robotics- beneficiary (1.1.2023 - 31.12.2025)
Results
XU, T.; DA, Z.; STREQUE, J.; HAVRÁNEK, Z.; XU, J.; ROCHA, R.; SAVOIA, A. Efficient Electrode Configuration for High-Sensitivity Performance with Minimal Analog Front-End Complexity. In Proceedings of the 2025 IEEE International Ultrasonics Symposium (IEEE IUS 2025). Utrecht, Netherlands: IEEE Computer Society, 2025. p. 1-3. ISBN: 979-8-3315-2332-9.Detail
HAVRÁNEK, Z.; HNIDKA, J.; DOSEDĚL, M.; KLUSÁČEK, S.: Testing workplace for generating partial discharges. URL: http://listen2future.ceitec.cz/vysledky/PD-TESTBENCH_v1. (Funkční vzorek)Detail
HNIDKA, J.; PIKULA, S.; ČALA, M.; KLUSÁČEK, S.; HAVRÁNEK, Z.: Software platform for data transmission via an acoustic communication channel and its testing. URL: http://listen2future.ceitec.cz/vysledky/AcoustCommPHY. (Software)Detail
HAVRÁNEK, Z.; HNIDKA, J.; DOSEDĚL, M.; KLUSÁČEK, S.: Workstation for the characterization of acoustic sensors in the ultrasonic range. URL: http://listen2future.ceitec.cz/vysledky/US-MEAS_v1. (Funkční vzorek)Detail
Responsibility: Havránek Zdeněk, Ing., Ph.D.