The lecture will provide a brief overview of the phenomena that occur in plasma of electric discharges and discuss the basic principles of discharges that are used in microelectronics and industrial surface modification. We will discuss fundamentals of etching and deposition by dry methods. Students will gain information on chemical vapor deposition (CVD), atomic layer deposition (ALD), and physical vapor deposition (PVD) methods, including methods using plasma processes such as plasma etching, plasma surface modification, plasma enhanced chemical vapor deposition (PECVD), and magnetron sputtering. The capabilities of these technologies will be presented using specific examples: etching of very narrow (high-aspect-ratio) structures, surface functionalization, deposition of diamond-like carbon layers, deposition of bioactive plasma polymers, and synthesis of carbon nanomaterials and metal-based nanoparticles. For better understanding, the processes will be demonstrated by experiments.