Course detail
Microelectronics and Assembly Technology
FEKT-BKC-MTSAcad. year: 2023/2024
The subject deals with the new, modern electronics components and technologies (hardware) with the impact on understanding of microelectronic passives and actives. Interconnection and packaging with new integration solutions are objectivesduring the whole life cycle starting with design, going through production processes and finishing with liquidation. It´s concerned to Surface Mount Technology and Hybrid Integrated Circuits, which are based on thick and thin film technologies. New performances of packaging, as Multi Chip Modules,, Chip Scale Packages, Flip Chips and Wafer Level Packages etc. are described and discused including modern semiconductor chips, going to 3D packages. Regarding to recieve the complex wiev for praxis in microelectronics technology area, selected parts from quality and environmental managment are included. The subject offers also good base about electronics hardware, in the whole cycle from design , production, use, servis and liquidation. That gives for student the possibility to involve in the praxis as well to continue in master degree study.
Language of instruction
Number of ECTS credits
Mode of study
Guarantor
Department
Entry knowledge
Rules for evaluation and completion of the course
Practical excercises are situated in Laboratory of microelectronic technologies and packaging, always in groups of maximum 6 students according to timetable set at the beginning of the semester. Compensation is possible only after personal agreement with teacher in exceptional cases (on the basis of a medical certificate).
Lab exercise :
1. Design of a hybrid integrated circuit.
2. Practical realization of hybrid integrated circuit.
3. Measurement of thick film resistors by four-wire method.
4. Trimming od thick film resistors and their statistical evaluation.
5. Soldering and measuring of temperature profiles.
6. Packaging and interconnection.
Aims
Basic knowledge and orientation in the field of design and manufacture of modern electronic circuits, devices and systems (hardware), which will enable the student to define, describe and also explain and possibly calculate basic parameters from the above mentioned problems.
Student after passing the subject:
1. Enables the basic issues of electronic hardware, its importance, its composition and its basic use
2. Understand and explain the basic nature of individual electronic components and describe their principles of implementation and use
3. Explains the theoretical function of basic hardware components and identifies its most commonly used types, names their parameters in relation to use in various applications
4. Is able to design hybrid integrated circuits, demonstrate and clarify the basic principles of their implementation and execution
5. Undertakes or supports an opinion on its own application in manufacturing, service and design institutions in the field of microelectronics and electrotechnics, and also develops basic prerequisites for master's studies
Study aids
Prerequisites and corequisites
Basic literature
Tummala, R.: Fundamentals of Microsystems Pacakaging, McGraw-Hill, New York, 2001, ISBN 0-07-137169- (EN)
Recommended reading
Elearning
Classification of course in study plans
- Programme BKC-MET Bachelor's 3 year of study, winter semester, compulsory
Type of course unit
Lecture
Teacher / Lecturer
Syllabus
Semiconductor chips - principle and their production
Basic performance of semiconductor chips and packaging
Thin and Thick Film Technology
Hybrid Integrated Circuits
SMD components for surface mount technology
Surface mount technology - technological operations
Technology of assembly (SMT)
Reliability Statistic Process Quality and cerfification in electronic production
Microelectronics and environment
Laboratory exercise
Teacher / Lecturer
Syllabus
Screen printing and Thick Film firing
Resistors trimming and ultrasonic bonding
Reflow soldering and its temperature profile, lead free solders
Basic operation in SMT, assembly process
Elearning