Course detail
Physical Principles of the Semiconductor Technology
FSI-TP0Acad. year: 2023/2024
Individual steps in semiconductors production and device manufacturing - physics and chemistry models
Language of instruction
Czech
Number of ECTS credits
2
Mode of study
Not applicable.
Guarantor
Department
Entry knowledge
Solid State Physics, chemistry
Rules for evaluation and completion of the course
Colloquium and a brief final report on the problem solution.
Aims
The main purpose of the lectures given by experts from industry is to provide the students ability to:
- list and describe individual steps in semiconductors production and device manufacturing
- find how basic physics is applied in semiconductors production manufaturing
- understand how industrial processes are optimized using physics and chemistry models
The course provides knowledge of processes in semiconductors production
- list and describe individual steps in semiconductors production and device manufacturing
- find how basic physics is applied in semiconductors production manufaturing
- understand how industrial processes are optimized using physics and chemistry models
The course provides knowledge of processes in semiconductors production
Study aids
Not applicable.
Prerequisites and corequisites
Not applicable.
Basic literature
KERN, Werner. /Handbook of Semiconductor Wafer Cleaning Technology:Science, Technology, and Applications/. New Jersey, U.S.A.: Noyes Publications, 1993. 623 s
KITTEL, Charles. /Úvod do fyziky pevných látek : Introduction to solid state physics (Orig.)/. 1. vyd. Praha: Academia, 1985. 598 s
WOLF, Stanley a Richard N. TAUBER. /Silicon Processing for the VLSI Era/. Sunset Beach, California, U.S.A.: Lattice Press, 1999. 960 s. Vol. 1: Process Technology
KITTEL, Charles. /Úvod do fyziky pevných látek : Introduction to solid state physics (Orig.)/. 1. vyd. Praha: Academia, 1985. 598 s
WOLF, Stanley a Richard N. TAUBER. /Silicon Processing for the VLSI Era/. Sunset Beach, California, U.S.A.: Lattice Press, 1999. 960 s. Vol. 1: Process Technology
Recommended reading
Not applicable.
Classification of course in study plans
Type of course unit
Lecture
39 hod., optionally
Teacher / Lecturer
Syllabus
The following topics will be covered:
Silicon wafer manufacturing technology overview
Silicon single crystal growth
Defects in silicon
Surface analysis in semiconductor manufacturing
Polishing and cleaning of silicon wafers
Silicon device fabrication overview
Silicon oxidation and impurity diffusion
Chemical vapor phase deposition and plasma assisted layer deposition
Photolithography, silicon oxide etching
Dry etching, metal sputtering
Applied statistics in industry
Silicon wafer manufacturing technology overview
Silicon single crystal growth
Defects in silicon
Surface analysis in semiconductor manufacturing
Polishing and cleaning of silicon wafers
Silicon device fabrication overview
Silicon oxidation and impurity diffusion
Chemical vapor phase deposition and plasma assisted layer deposition
Photolithography, silicon oxide etching
Dry etching, metal sputtering
Applied statistics in industry