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FEKT-BPC-PSMAcad. year: 2022/2023
Subject deals with topics of printed circuit board (PCB) production and assembly process from the components and used chemistry at the entrance of the process to the repairs and quality requirements at the assembly process exit. Subject deals with basic materials for production of printed circuit boards (PCB), their properties, application and comparison with inorganic substrates, technology procedures of single-, double- and multi-layer PCBs production, new technology trends of PCB production, surface mount technology (SMT), throuh hole technology (THT) and combined mounting of electronic parts and quality requirements of placement and soldering.
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Department
Learning outcomes of the course unit
Prerequisites
Co-requisites
Recommended optional programme components
Literature
Planned learning activities and teaching methods
Assesment methods and criteria linked to learning outcomes
Language of instruction
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Course curriculum
Aims
Specification of controlled education, way of implementation and compensation for absences
Classification of course in study plans
branch BIT , 2. year of study, summer semester, 5 credits, elective
Lecture
Teacher / Lecturer
Exercise in computer lab
Laboratory exercise
Field trip
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