Course detail
Design and Fabrication of Electronic Instruments
FEKT-BKC-NRPAcad. year: 2022/2023
Design and demands on electronic instruments and its manufacturing. Security of measuring instruments against unfavourable external and internal influences. The take away of heat from instrument case. Security of persons against accidents caused by electricity. Grounding and shielding. Ergonometry of measuring instruments. Technical diagnostics.
Language of instruction
Czech
Number of ECTS credits
6
Mode of study
Not applicable.
Guarantor
Department
Learning outcomes of the course unit
The graduate is able to:
- describe the basic principles of an industrial property protection,
- explain the production technology preparation,
- describe the used method of electromagnetic compatibility (EMC),
- describe the used ensurings of signal distribution,
- select appropriate power source distribution on the basis of given requirements,
- name individually parazitic couplings and transfers in electronic circuits,
- explain principles of shielding,
- explain principles of thermal management,
- describe and explain individual methods of soldering,
- discuss principal possibilities of printed circuit boards,
- discuss advantages and disadvantages of surface mount technology,
- estimate respectably safety requirements for electronic equipments,
- describe the used method of diagnostics,
- discuss advantages and disadvantages of quality management methods.
- describe the basic principles of an industrial property protection,
- explain the production technology preparation,
- describe the used method of electromagnetic compatibility (EMC),
- describe the used ensurings of signal distribution,
- select appropriate power source distribution on the basis of given requirements,
- name individually parazitic couplings and transfers in electronic circuits,
- explain principles of shielding,
- explain principles of thermal management,
- describe and explain individual methods of soldering,
- discuss principal possibilities of printed circuit boards,
- discuss advantages and disadvantages of surface mount technology,
- estimate respectably safety requirements for electronic equipments,
- describe the used method of diagnostics,
- discuss advantages and disadvantages of quality management methods.
Prerequisites
The subject knowledge on the secondary school level is required.
Co-requisites
Not applicable.
Planned learning activities and teaching methods
Teaching methods include lectures and computer laboratories. The course is taking materials at the web pages. Students have to prepare one project/assignment during the course.
Assesment methods and criteria linked to learning outcomes
Practicals - 30 points; minimum 20 points.
Final exam - 70 points; minimum 30 points.
Final exam - 70 points; minimum 30 points.
Course curriculum
1. Construction of electrical equipment - principles, component base, signal distribution, power distribution.
2. Microcontrollers - architecture, terminology, distribution, selection parameters, peripherals.
3. Microcontrollers - peripheral control, communication, SW and HW design principles, assembler.
4. Input controls - buttons, vibration, keyboards, capacitive sensors, touchscreens.
5. Output controls - LED, displays: LED; LCD; alphanumeric; graphic, buzzer.
6. signal and power loads switching - principles, load: real; inductive; capacitive, power regulation, boosting, cooling.
7. Bus - criteria, parameters, description: SPI; UART; RS232; RS485; I2C; CAN; 1-WIRE; IrDa; OpenTherm; current loop, level adjustment.
8. Bus - bus drivers and controllers, protection, transmission security, data protection, fault detection, cryptography.
9. Power circuits - linear sources, switched sources, ripple suppression, interference, overcurrent detection, protection against electrical shocks.
10. Integrated circuits - memories, real time, AD / DA circuits, motion sensings, sensing of electrical and non-electrical quantities.
11. Low-power operation - battery power, principles, HW and SW measures, charging, power management.
12. Advanced Product Quality Planning (APQP) - design concept, optimization, quality, elimination, method review, terminology.
2. Microcontrollers - architecture, terminology, distribution, selection parameters, peripherals.
3. Microcontrollers - peripheral control, communication, SW and HW design principles, assembler.
4. Input controls - buttons, vibration, keyboards, capacitive sensors, touchscreens.
5. Output controls - LED, displays: LED; LCD; alphanumeric; graphic, buzzer.
6. signal and power loads switching - principles, load: real; inductive; capacitive, power regulation, boosting, cooling.
7. Bus - criteria, parameters, description: SPI; UART; RS232; RS485; I2C; CAN; 1-WIRE; IrDa; OpenTherm; current loop, level adjustment.
8. Bus - bus drivers and controllers, protection, transmission security, data protection, fault detection, cryptography.
9. Power circuits - linear sources, switched sources, ripple suppression, interference, overcurrent detection, protection against electrical shocks.
10. Integrated circuits - memories, real time, AD / DA circuits, motion sensings, sensing of electrical and non-electrical quantities.
11. Low-power operation - battery power, principles, HW and SW measures, charging, power management.
12. Advanced Product Quality Planning (APQP) - design concept, optimization, quality, elimination, method review, terminology.
Work placements
Not applicable.
Aims
To be introduced to practicle principles of designing electronic instruments and devices as regards both electrical and mechanical aspects - in the industrial environment.
The student acquires concrete application knowledge of electronic instrument design, which is otherwise obtained through long-term development practice. Emphasis is laid on understanding the physical essence of parasitic events so that their knowledge can be applied to other cases. He learns to foresee and anticipate the appearance of many problems arising in the development of new instruments in both the electrical and the mechanical part of the design.
The student acquires concrete application knowledge of electronic instrument design, which is otherwise obtained through long-term development practice. Emphasis is laid on understanding the physical essence of parasitic events so that their knowledge can be applied to other cases. He learns to foresee and anticipate the appearance of many problems arising in the development of new instruments in both the electrical and the mechanical part of the design.
Specification of controlled education, way of implementation and compensation for absences
The content and forms of instruction in the evaluated course are specified by a regulation issued by the lecturer responsible for the course and updated for every academic year.
Recommended optional programme components
Not applicable.
Prerequisites and corequisites
Not applicable.
Basic literature
Not applicable.
Recommended reading
Fowler, K.R.: Electronic instrument design. Oxford University Press, 1996 (EN)
HRBÁČEK, Jiří. Komunikace mikrokontroléru s okolím. Praha: BEN - technická literatura, 1999. ISBN 80-86056-42-2. (CS)
MANN, Burkhard. C pro mikrokontroléry: ANSI-C, kompilátory C, spojovací programy - linkery, práce s ATMEL AVR a MSC-51, příklady programování v jazyce C, nástroje pro programování, tipy a triky .. Praha: BEN - technická literatura, 2003. µC & praxe. ISBN 80-7300-077-6. (CS)
HRBÁČEK, Jiří. Komunikace mikrokontroléru s okolím. Praha: BEN - technická literatura, 1999. ISBN 80-86056-42-2. (CS)
MANN, Burkhard. C pro mikrokontroléry: ANSI-C, kompilátory C, spojovací programy - linkery, práce s ATMEL AVR a MSC-51, příklady programování v jazyce C, nástroje pro programování, tipy a triky .. Praha: BEN - technická literatura, 2003. µC & praxe. ISBN 80-7300-077-6. (CS)
Elearning
eLearning: currently opened course
Classification of course in study plans
- Programme BKC-MET Bachelor's 3 year of study, winter semester, compulsory-optional
Type of course unit
Lecture
26 hod., optionally
Teacher / Lecturer
Syllabus
Demands on electronic instruments and systems. Design methodology, technical documentation. Design of signal lines: symmetrical and non-symmetrical lines, properties of signal lines, execution of connections, printed circuits and their properties, optical lines.
Supply sources: mains supply, mains switches, transformers, means of interference suppression (suppression capacitors, suppression chokes, suppression elements). Supply voltage distribution: supply distribution in instrument housing and on printed circuit boards, distribution in the ground, galvanic separation of systems (impulse tranformers, optrons).
Parasitic events and their suppression: coupling in input and outtput circuits, coupling on line resistances, parasitic capacitances and inductances, transient resistances, thermoelectric voltage, overvoltage on inductive load.
Signal transmission over long lines: reflections in the lines, crosstalk, charging and discharging the lines.
Electric and magnetic field screening: electric field screening of systems and lines, magnetic field screening of systems and lines. Equipotential guarding: insulation ring guarding, teflon support point, examples of active insulation of critical points.
Selection of discrete components and application recommendation: resistors, potentiometers and potentiometric trimmers, capacotors and capacitive trimmers, inductors, diodes, transistors (bipolar, unipolar; power, HF).
Application recommendation for analog and digital integrated circuits: operational and transimpedance amplifiers, analog multiplexersand demultiplexers, comparators and timers, D/A and A/D converters, digital integrated circuits, microprocessors.
Mechanics design: regulation and control elements and their lay-out, communication and indication elements, lay-out of regulation and communication elements on the front panel of the instrument, graphic and technical aspects of the mechanical part of design, design of instrument housing.
Mechanical resistance of devices: resistance to shocks, vibration, moisture, water; abstraction of heat from the device, cooling elements, temperature stabilization (thermostatic control).
Connection of conductors and components: technology of printed circuit production, soldered.connections, wire-wrap connections, cut-in connections; technology of surface assembly.
Safety requirements: fundamental requirements, types of instrument classes, work environment, danger-to-touch protection, insulation requirements, surface paths and distances, movable liead-in wires.
Reliability of electronic instruments. Technical diagnostics and debugging of electronic instruments.
Quality management. Information in electronics, its collection and processing. Catalogues, electronic databases.
Supply sources: mains supply, mains switches, transformers, means of interference suppression (suppression capacitors, suppression chokes, suppression elements). Supply voltage distribution: supply distribution in instrument housing and on printed circuit boards, distribution in the ground, galvanic separation of systems (impulse tranformers, optrons).
Parasitic events and their suppression: coupling in input and outtput circuits, coupling on line resistances, parasitic capacitances and inductances, transient resistances, thermoelectric voltage, overvoltage on inductive load.
Signal transmission over long lines: reflections in the lines, crosstalk, charging and discharging the lines.
Electric and magnetic field screening: electric field screening of systems and lines, magnetic field screening of systems and lines. Equipotential guarding: insulation ring guarding, teflon support point, examples of active insulation of critical points.
Selection of discrete components and application recommendation: resistors, potentiometers and potentiometric trimmers, capacotors and capacitive trimmers, inductors, diodes, transistors (bipolar, unipolar; power, HF).
Application recommendation for analog and digital integrated circuits: operational and transimpedance amplifiers, analog multiplexersand demultiplexers, comparators and timers, D/A and A/D converters, digital integrated circuits, microprocessors.
Mechanics design: regulation and control elements and their lay-out, communication and indication elements, lay-out of regulation and communication elements on the front panel of the instrument, graphic and technical aspects of the mechanical part of design, design of instrument housing.
Mechanical resistance of devices: resistance to shocks, vibration, moisture, water; abstraction of heat from the device, cooling elements, temperature stabilization (thermostatic control).
Connection of conductors and components: technology of printed circuit production, soldered.connections, wire-wrap connections, cut-in connections; technology of surface assembly.
Safety requirements: fundamental requirements, types of instrument classes, work environment, danger-to-touch protection, insulation requirements, surface paths and distances, movable liead-in wires.
Reliability of electronic instruments. Technical diagnostics and debugging of electronic instruments.
Quality management. Information in electronics, its collection and processing. Catalogues, electronic databases.
Elearning
eLearning: currently opened course