Publication result detail

Numerical solution of phase change materials for thermal management of integrated circuit packages

FIALA, P.; STEINBAUER, M.; BĚHUNEK, I.

Original Title

Numerical solution of phase change materials for thermal management of integrated circuit packages

English Title

Numerical solution of phase change materials for thermal management of integrated circuit packages

Type

Peer-reviewed article not indexed in WoS or Scopus

Original Abstract

An analytical description and solution of heat transfer, melting and freezing process in 1D applied to inorganic crystalline salts is presented. Numerical analysis of a real 3D model is also carried out. Some of the 3D results obtained by means of the finite element method were verified experimentally in the laboratory.

English abstract

An analytical description and solution of heat transfer, melting and freezing process in 1D applied to inorganic crystalline salts is presented. Numerical analysis of a real 3D model is also carried out. Some of the 3D results obtained by means of the finite element method were verified experimentally in the laboratory.

Keywords

Phase change, finite element method, heat transfer, integrated circuit

Key words in English

Phase change, finite element method, heat transfer, integrated circuit

Authors

FIALA, P.; STEINBAUER, M.; BĚHUNEK, I.

RIV year

2010

Released

30.11.2008

Publisher

Institute of thermomechanics AS CR

Location

Praha, CR

ISBN

0001-7043

Periodical

Acta Technica ČSAV

Volume

53

Number

1

State

Czech Republic

Pages from

295

Pages to

308

Pages count

14

BibTex

@article{BUT49679,
  author="Pavel {Fiala} and Miloslav {Steinbauer} and Ivo {Běhunek}",
  title="Numerical solution of phase change materials for thermal management of integrated circuit packages",
  journal="Acta Technica ČSAV",
  year="2008",
  volume="53",
  number="1",
  pages="295--308",
  issn="0001-7043"
}