Publication detail

Instruction mapping techniques for processors with very long instruction word architectures

MEGO, R. FRÝZA, T.

Original Title

Instruction mapping techniques for processors with very long instruction word architectures

Type

journal article in Web of Science

Language

English

Original Abstract

This paper presents an instruction mapping technique for generating a low-level assembly code for digital signal processing algorithms. This technique helps developers to implement retargetable kernel functions with the performance benefits of the low-level assembly languages. The approach is aimed at exceptionally long instruction word (VLIW) architectures, which benefits the most from the proposed method. Mapped algorithms are described by the signal-flow graphs, which are used to find possible parallel operations. The algorithm is converted into low-level code and mapped to the target architecture. This process also introduces the optimization of instruction mapping priority, which leads to the more effective code. The technique was verified on selected kernels, compared to the common programming methods, and proved that it is suitable for VLIW architectures and for portability to other systems.

Keywords

digital signal processors, parallel architectures, low-level code, instruction mapping, signal-flow graph

Authors

MEGO, R.; FRÝZA, T.

Released

12. 12. 2022

Publisher

FEI STU Bratislava

Location

Bratislava

ISBN

1339-309X

Periodical

Journal of Electrical Engineering

Year of study

73

Number

6

State

Slovak Republic

Pages from

387

Pages to

395

Pages count

9

URL

http://iris.elf.stuba.sk/JEEEC/data/pdf/6_122-03.pdf

BibTex

@article{BUT180540,
  author="Roman {Mego} and Tomáš {Frýza}",
  title="Instruction mapping techniques for processors with very long instruction word architectures",
  journal="Journal of Electrical Engineering",
  year="2022",
  volume="73",
  number="6",
  pages="387--395",
  doi="10.2478/jee-2022-0053",
  issn="1339-309X",
  url="http://iris.elf.stuba.sk/JEEEC/data/pdf/6_122-03.pdf"
}