Publication detail

Vliv koeficientu přenosu tepla na pájení přetavením

HURBAN, M. SZENDIUCH, I.

Original Title

Vliv koeficientu přenosu tepla na pájení přetavením

Type

article in a collection out of WoS and Scopus

Language

English

Original Abstract

Reflow soldering is nowadays the most used method of connecting electronic components into product. Soldering itself is done at temperatures between 235°C - 245°C. Effectivnes of heat transfer is a very important part of the process.This temperature is very high for some components and precise temperature adjustment and regulation (profiling) is leading part of reliable and effective production process. Heat transfer coefficient is essential for the whole process, in fact it shows effectivness of the soldering process from energy transfer point of view. The main influence onto this coefficient has the mechanical construction of the soldering machine. This article describes some basics of heat transfer theory and processes, needed for effective soldering process.

Keywords

industry 4.0, soldering, sensors

Authors

HURBAN, M.; SZENDIUCH, I.

Released

5. 11. 2021

Location

Plzen

ISBN

1802-4564

Periodical

ElectroScope - http://www.electroscope.zcu.cz

Year of study

2

Number

2

State

Czech Republic

Pages from

1

Pages to

3

Pages count

3

URL

http://147.228.94.30/images/PDF/Rocnik2020/Cislo1_2021/r15c1c3.pdf

BibTex

@inproceedings{BUT179011,
  author="Milan {Hurban} and Ivan {Szendiuch}",
  title="Vliv koeficientu přenosu tepla na pájení přetavením",
  year="2021",
  journal="ElectroScope - http://www.electroscope.zcu.cz",
  volume="2",
  number="2",
  pages="1--3",
  address="Plzen",
  issn="1802-4564",
  url="http://147.228.94.30/images/PDF/Rocnik2020/Cislo1_2021/r15c1c3.pdf"
}