Publication detail

Conductive Printing of RFID Tag and Chip Contacting Methods for High Volume Additive Production

KERNDL, M. ŠTEFFAN, P.

Original Title

Conductive Printing of RFID Tag and Chip Contacting Methods for High Volume Additive Production

Type

conference paper

Language

English

Original Abstract

The emerging Internet of Things (IoT) paradigm keeps pressure on constant innovation of manufacturing processes, mainly on additive technologies that can significantly reduce waste and cost of manufactured parts. Promising field for high volume, low cost and quick time to market additive fabrication method is printing. This paper briefly compares current printing technologies used for electronics fabrication, mainly for low cost Radio Frequency Identification (RFID), Near Field Communication (NFC) tags, smart labels, smart packaging, sensors etc. with focus on "offset lithography". This method raises a big challenges, one of them is chip contacting method. This work summarizes current contacting methods suitable for printed electronics on flexible substrates with focus on promising contactless RFID magnetic coupling method that does not require conductive connection between chip and antenna itself.

Keywords

IoT; Printed electronics; RFID; Chip Contacting; Conductive printing;

Authors

KERNDL, M.; ŠTEFFAN, P.

Released

26. 7. 2021

ISBN

978-1-6654-2933-7

Book

44th International Conference on Telecommunications and Signal Processing

Pages from

352

Pages to

356

Pages count

5

URL

https://ieeexplore.ieee.org/document/9522666

BibTex

@inproceedings{BUT171976,
  author="Michal {Kerndl} and Pavel {Šteffan}",
  title="Conductive Printing of RFID Tag and Chip Contacting Methods for High Volume Additive Production",
  booktitle="44th International Conference on Telecommunications and Signal Processing",
  year="2021",
  pages="352--356",
  doi="10.1109/TSP52935.2021.9522666",
  isbn="978-1-6654-2933-7",
  url="https://ieeexplore.ieee.org/document/9522666"
}