Publication result detail

Quality evaluation software of the soldered connection

PAVLÍK, M.

Original Title

Quality evaluation software of the soldered connection

English Title

Quality evaluation software of the soldered connection

Type

Paper in proceedings (conference paper)

Original Abstract

This paper deals with special software for real time testing and consequently archiving pictures of the soldered connection. Described tools provide detection of the soldered connection quality wrong soldered SMD. Software also shows angle of the soldered connection and is able to calculate deviation from the standard.

English abstract

This paper deals with special software for real time testing and consequently archiving pictures of the soldered connection. Described tools provide detection of the soldered connection quality wrong soldered SMD. Software also shows angle of the soldered connection and is able to calculate deviation from the standard.

Keywords

SMD soldering, package placing

Key words in English

SMD soldering, package placing

Authors

PAVLÍK, M.

RIV year

2010

Released

23.04.2008

Publisher

Publishing House of Izevsk State Technical University

Location

Izevsk

ISBN

978-5-7526-0355-6

Book

First Forum of Young Researchers Proceedings

Edition

1

Pages from

316

Pages to

320

Pages count

5

BibTex

@inproceedings{BUT26584,
  author="Michal {Pavlík}",
  title="Quality evaluation software of the soldered connection",
  booktitle="First Forum of Young Researchers Proceedings",
  year="2008",
  series="1",
  number="1",
  pages="316--320",
  publisher="Publishing House of Izevsk State Technical University",
  address="Izevsk",
  isbn="978-5-7526-0355-6"
}