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KRATOCHVÍL, T.; PETRŽELA, J.; ŠOTNER, R.; DŘÍNOVSKÝ, J.; GÖTTHANS, T.; WIEERS, A.; GILLON, R.; REYNIER, P.; POUPIN, Y.
Original Title
Measurements for RF Amplifiers, Bond Wire Fusing and MOS Power Cells
English Title
Type
Chapter in a book
Original Abstract
This chapter focuses on several areas regarding measurements (including methodology, test-bed development and measurement of results itself) of experimental results in the framework of an established cooperation with several partners from industry. We give attention to measurements for RF amplifiers, bond wire fusing and MOS power cells. We also include on-chip measurements of RF passive components and pay attention to heat, stress and reliability measurements. Measurements set-ups have been made in close cooperation with ON Semiconductor Belgium (Oudenaarde, Belgium) and with ACCO Semiconductor (Louveciennes, France).
English abstract
Keywords
-
Key words in English
Authors
RIV year
2021
Released
07.11.2019
Publisher
Springer
ISBN
978-3-030-30725-7
Book
Nanoelectronic Coupled Problems Solutions
Pages from
487
Pages to
515
Pages count
28
URL
https://link.springer.com/chapter/10.1007/978-3-030-30726-4_21
BibTex
@inbook{BUT159842, author="Tomáš {Kratochvíl} and Jiří {Petržela} and Roman {Šotner} and Jiří {Dřínovský} and Tomáš {Götthans} and Aarnout {Wieers} and Renaud {Gillon} and Pascal {Reynier} and Yannick {Poupin}", title="Measurements for RF Amplifiers, Bond Wire Fusing and MOS Power Cells", booktitle="Nanoelectronic Coupled Problems Solutions", year="2019", publisher="Springer", pages="487--515", doi="10.1007/978-3-030-30726-4\{_}21", isbn="978-3-030-30725-7", url="https://link.springer.com/chapter/10.1007/978-3-030-30726-4_21" }