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Ph.D.
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2025
SKÁCEL, J.; OTÁHAL, A. The influence of current on the structure of the intermetallic compound in solder alloys. Journal of Electrical Engineering-Elektrotechnicky Casopis, 2025, vol. 76, iss. 1, p. 48-57. ISSN: 1335-3632.
Článek WoS
KOPŘIVA, P.; SKÁCEL, J.; OTÁHAL, A. Development of a New Ceramic Package Design for Special Applications. In Proceedings of the International Spring Seminar on Electronics Technology. Conference proceedings (International Spring Seminar on Electronics Technology). Budapest: IEEE Computer Society, 2025. p. 1-5. ISBN: 9798331512163.
Stať ve sborníku v databázi WoS či Scopus
2024
KOPŘIVA, P.; OTÁHAL, A. Design of a device for measuring the electrical resistance of soldered joints during fatigue tests. In Proceedings II of the 30th Conference STUDENT EEICT 2024 Selected papers. 1. Brno: Brno University of Technology, Faculty of Electrical Engineering and Communication, 2024. p. 155-158. ISBN: 978-80-214-6231-1.
OTÁHAL, A.; LUKÁCS, P.; ROVENSKÝ, T. A Contribution to Printed Circuit Boards' Miniaturization by the Vertical Embedding of Passive Components. JOURNAL OF ELECTRONIC PACKAGING, 2024, vol. 146, iss. 1, p. 011004-1 (011004-12 p.)ISSN: 1043-7398.
2023
CHMELÍKOVÁ, L.; FECKO, P.; CHMELÍK, J.; SKÁCEL, J.; OTÁHAL, A.; FOHLEROVÁ, Z. Demolded hollow high aspect-ratio parylene-C micropillars for real-time mechanosensing applications. Applied Materials Today, 2023, vol. 31, iss. 1, p. 1-12. ISSN: 2352-9407.
OTÁHAL, A.; GABLECH, I.; SKÁCEL, J.; SZENDIUCH, I. Investigation of the Influence of Dam and Fill Encapsulating Material Shrinkage on a Semiconductor Substrate Warpage. In Proceedings of the International Spring Seminar on Electronics Technology. 2023. p. 1-5. ISBN: 979-8-3503-3484-5.
2022
KOPŘIVA, P.; OTÁHAL, A. Design of a micromanipulator for repairs of printed circuit boards. In Proceedings II of the 28th Conference STUDENT EEICT 2022 Selected papers. 1. Brno: Brno University of Technology, Faculty of Electrical Engineering and Communication, 2022. p. 40-43. ISBN: 978-80-214-6030-0.
OTÁHAL, A. Pájecí stanice s vyhřívanou šablonou pro proces reballing. DPS Elektronika od A do Z, 2022, roč. 13, č. 4, s. 24-25. ISSN: 1805-5044.
Článek recenzovaný mimo WoS a Scopus
2021
FOHLEROVÁ, Z.; GABLECH, I.; OTÁHAL, A.; FECKO, P. SiO2-decorated Parylene C micropillars designed to probe cellular force. SENSORS 2021 conference, Milano, Italy, 2021. p. 1 (1 s.).
Abstrakt
FOHLEROVÁ, Z.; GABLECH, I.; OTÁHAL, A.; FECKO, P. SiO2-Decorated Parylene C Micropillars Designed to Probe Cellular Force. Advanced Materials Interfaces, 2021, vol. 8, iss. 6, p. 2001897-1 (2001897-8 p.)ISSN: 2196-7350.
OTÁHAL, A.; ŘEZNÍČEK, M.; SKÁCEL, J. Evaluation of Influence of Flux Residues After Rework and Repair Process of Underfilled BGA Packages. In 2021 44th International Spring Seminar on Electronics Technology (ISSE). Conference proceedings (International Spring Seminar on Electronics Technology). IEEE, 2021. iss. 1, p. 1-4. ISBN: 978-1-6654-1477-7. ISSN: 2161-2536.
OTÁHAL, A.; SKÁCEL, J.; SZENDIUCH, I.; BÚRAN, M. Comparison of Sample Preparation with Microsection and FIB Depending on the Detail of Structure. In 2021 44th International Spring Seminar on Electronics Technology (ISSE). Conference proceedings (International Spring Seminar on Electronics Technology). IEEE, 2021. iss. 1, p. 1-6. ISBN: 978-1-6654-1477-7. ISSN: 2161-2536.
ŠIMONOVÁ, L.; MATĚJKA, M.; KNÁPEK, A.; KRÁLÍK, T.; POKORNÁ, Z.; MIKA, F.; FOŘT, T.; MAN, O.; ŠKARVADA, P.; OTÁHAL, A.; ČUDEK, P. Nanostructures for Achieving Selective Properties of a Thermophotovoltaic Emitter. Nanomaterials, 2021, vol. 11, iss. 9, p. 1-14. ISSN: 2079-4991.
2020
FOHLEROVÁ, Z.; ZHU, H.; HUBÁLEK, J.; NI, S.; PODEŠVA, P.; OTÁHAL, A.; NEUŽIL, P.; YOBAS, L. Rapid Characterization of Biomolecules’ Thermal Stability in Segmented Flow-Through Optofluidic Microsystem. Scientific Reports, 2020, vol. 10, iss. 1, p. 1-9. ISSN: 2045-2322.
BÍLEK, O.; FIALOVÁ, T.; OTÁHAL, A.; ADAM, V.; ŠMERKOVÁ, K.; FOHLEROVÁ, Z. Antibacterial activity of AgNPs-TiO2 nanotubes: influence of different nanoparticle stabilizers. RSC Advances, 2020, vol. 10, iss. 72, p. 1-10. ISSN: 2046-2069.
OTÁHAL, A.; SKÁCEL, J.; SZENDIUCH, I.; JANKOVSKÝ, J. Current Load of Thick-film Pastes for Power Applications. In 2020 43rd International Spring Seminar on Electronics Technology (ISSE). Conference proceedings (International Spring Seminar on Electronics Technology). IEEE, 2020. p. 1-6. ISBN: 978-1-7281-6773-2. ISSN: 2161-2536.
OTÁHAL, A.; SKÁCEL, J.; SZENDIUCH, I. Investigation of Metallographic Etchants Selectivity for Tin Solder Alloys. In 2020 43rd International Spring Seminar on Electronics Technology (ISSE). Conference proceedings (International Spring Seminar on Electronics Technology). IEEE, 2020. p. 1-6. ISBN: 978-1-7281-6773-2. ISSN: 2161-2536.
2019
OTÁHAL, A.; SKÁCEL, J.; SZENDIUCH, I. Influence of Electric Current at Solidification of Solder. In 42nd International Spring Seminar on Electronics Technology (ISSE). Conference proceedings (International Spring Seminar on Electronics Technology). IEEE, 2019. p. 1-5. ISSN: 2161-2528.
OTÁHAL, A.; SKÁCEL, J.; SZENDIUCH, I. New Possible Way for Brazing of Thick Film Cermet Conductors. In 42nd International Spring Seminar on Electronics Technology (ISSE). Conference proceedings (International Spring Seminar on Electronics Technology). IEEE, 2019. p. 1-5. ISSN: 2161-2528.
2018
OTÁHAL, A.; SZENDIUCH, I. Influence of heat flow direction on solder ball interfacial layer. Journal of Electrical Engineering-Elektrotechnicky Casopis, 2018, vol. 69, iss. 4, p. 305-310. ISSN: 1339-309X.
OTÁHAL, A.; SOMER, J.; SZENDIUCH, I. Influence of heating direction on BGA solder balls structure. In Microelectronics and Packaging Conference (EMPC) & Exhibition, 2017 21st European. 2018. p. 1-4. ISBN: 978-0-9568086-4-6.
SKÁCEL, J.; SZENDIUCH, I.; OTÁHAL, A. Creation of Cavities in High-temperature Ceramics. In 2018 41st International Spring Seminar on Electronics Technology. Conference proceedings (International Spring Seminar on Electronics Technology). Zlatibor, Serbia: IEEE Computer Society, 2018. iss. 1, p. 249-254. ISSN: 2161-2536.
SKÁCEL, J.; SZENDIUCH, I.; OTÁHAL, A.; HEJÁTKOVÁ, E. X-ray Inspection of Ceramic Structures. In 2018 41st International Spring Seminar on Electronics Technology. Conference proceedings (International Spring Seminar on Electronics Technology). Zlatibor, Serbia: IEEE Computer Society, 2018. iss. 1, p. 254-257. ISSN: 2161-2536.
2016
OTÁHAL, A.; ŠIMEK, V.; CRHA, A.; RŮŽIČKA, R.; SZENDIUCH, I. Innovative Methods for Through Holes Plating. In 2016 39th International Spring Seminar on Electronics Technology (ISSE). Conference proceedings (International Spring Seminar on Electronics Technology). Pilsen, Czech Republic: University of West Bohemia, 2016. p. 48-52. ISBN: 978-1-5090-1389-0. ISSN: 2161-2536.
OTÁHAL, A.; CRHA, A.; ŠIMEK, V.; RŮŽIČKA, R.; SZENDIUCH, I. ENHANCED METHOD OF THROUGH-HOLE COPPER PLATING. Proceedings of the 22nd Conference STUDENT EEICT 2016. Brno: Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií, 2016. p. 610.ISBN: 978-80-214-5350-0.
Stať ve sborníku mimo WoS a Scopus
SKÁCEL, J.; OTÁHAL, A.; ŘIHÁK, P.; SZENDIUCH, I. The Quality of BGA Solder Joint with Underfill. In Sborník IMAPS flash Conference 2016. ElectroScope. 2016. iss. 3, p. 19-22. ISBN: 978-80-214-5419-4. ISSN: 1802-4564.
OTÁHAL, A.; ŠIMEK, V.; CRHA, A.; RŮŽIČKA, R.; SZENDIUCH, I. Innovative Methods in Activation Process of Through-hole Plating. Periodica Polytechnica-Electrical Engineering, 2016, vol. 60, iss. 4, p. 217-222. ISSN: 0324-6000.
Článek Scopus
SKÁCEL, J.; OTÁHAL, A.; SZENDIUCH, I. Sensitive Analysis of IR Heat Emitter for Soldering. In Proceedings of the 22nd Conference STUDENT EEICT 2016. Brno: Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií, 2016. p. 655-659. ISBN: 978-80-214-5350-0.
ŘEZNÍČEK, M.; OTÁHAL, A.; BURŠÍK, M.; JANKOVSKÝ, J. System for maintaining the dispense capillary at a constant height above the surface. In 39th International Spring Seminar on Electronics Technology "Printed Electronics and Smart Textiles". Conference proceedings (International Spring Seminar on Electronics Technology). Pilsen, Czech Republic: University of West Bohemia in Pilsen, 2016. p. 430-432. ISBN: 978-1-5090-1389-0. ISSN: 2161-2536.
SKÁCEL, J.; OTÁHAL, A.; SZENDIUCH, I. Designing of infrared heater with homogenous heat transfer. In Proceedings of the International Spring Seminar on Electronics Technology, 39th International Spring Seminar on Electronics Technology, ISSE 2016. Conference proceedings (International Spring Seminar on Electronics Technology). Volume 2016-September. Pilsen, Czech Republic: IEEE, 345 E 47TH ST, NEW YORK, NY 10017 USA, 2016. iss. 1, p. 62-65. ISBN: 978-1-5090-1389-0. ISSN: 2161-2536.
OTÁHAL, A.; SZENDIUCH, I.; ŠIMEK, V.; CRHA, A.; RŮŽIČKA, R. Inovace procesu pokovení průchozích otvorů v DPS. DPS Elektronika od A do Z, 2016, č. 1/2016, s. 2-3. ISSN: 1805-5044.
2015
SZENDIUCH, I.; OTÁHAL, A.; PSOTA, B. Mechanické testování elektronických sestav. In Mechanické testování elektronických sestav. 1. Brno: Novpress Brno, 2015. s. 1-26. ISBN: 978-80-214-5271-8.
SZENDIUCH, I.; OTÁHAL, A.; PSOTA, B. Optimalizace modelu vícevrstvé DPS při mechanickém testování. DPS Elektronika od A do Z, 2015, roč. 1, č. 6, s. 4-5. ISSN: 1805-5044.
OTÁHAL, A.; SZENDIUCH, I.; ŠIMEK, V.; CRHA, A.; RŮŽIČKA, R. Optimization of Through-hole Plating Method for Prototyping. In Abstracts Proceedings, International flash conference IMAPS - Czech and Slovak chapter. ElectroScope. 2015. iss. 1_2016, p. 54-56. ISBN: 978-80-214-5270-1. ISSN: 1802-4564.
OTÁHAL, A.; PSOTA, B.; SZENDIUCH, I. The Vibration Testing as Tool for Optimizing of Two PCB Connection. In Novel Trends in Electronics Manufacturing - Book of Abtracts 38th International Spring Seminar on Electronics Technology. 2015. p. 339-342. ISBN: 978-963-313-177-0.
PSOTA, B.; OTÁHAL, A.; SZENDIUCH, I. Influence of the cavities on the PCB mechanical properties. CIRCUIT WORLD, 2015, vol. 41, iss. 2, p. 1-6. ISSN: 0305-6120.
PSOTA, B.; SZENDIUCH, I.; OTÁHAL, A. Influence of the PCB Attachment on the Mechanical Properties in Modal Analysis. In Proceedings on 20th European Microelectronics and Packaging Conference & Exhibition. 2015. p. 1-4. ISBN: 978-0-9568086-1-5.
OTÁHAL, A.; SZENDIUCH, I.; ŠEFARA, P. MECHANICAL BEHAVIOR OF SMD SOLDER JOINT SOLDERED UNDER NITROGEN ATMOSPHERE. Abstracts Proceedings, International flash conference IMAPS - Czech and Slovak chapter. 2015. p. 45.ISBN: 978-80-214-5270-1.
Konferenční sborník (ne stať)
SZENDIUCH, I.; SOMER, J.; VALA, R.; ADÁMEK, M.; BURŠÍK, M.; HEJÁTKOVÁ, E.; OTÁHAL, A.; PSOTA, B.; ŘEZNÍČEK, M.; ŘIHÁK, P.; SKÁCEL, J. Moderní mikroelektronické technologie - základ elektronického hardware. 1. 1. Brno: Vysoké učení technické v Brně, FEKT, 2015. 188 s. ISBN: 978-80-214-5293-0.
Odborná kniha
2014
OTÁHAL, A.; ADÁMEK, M.; SZENDIUCH, I. Impact of solder paste drying on the solderability. In 37th Int. Spring Seminar on Electronics Technology. Dresden: IEEE, 2014. č. 37, s. 198-201. ISBN: 978-1-4799-4455-2.
PSOTA, B.; OTÁHAL, A.; SZENDIUCH, I. INFLUENCE OF THE CAVITIES ON THE PCB MECHANICAL PROPERTIES. In Electronic Devices and Systems, IMAPS CS International Conference 2014. Brno: Vysoké učení technické v Brně, 2014. s. 1-7. ISBN: 978-80-214-4985-5.
SZENDIUCH, I.; PSOTA, B.; OTÁHAL, A. Nové směry v konstrukci plošných spojů a mechanické testování. DPS Elektronika od A do Z, 2014, roč. 5., č. 1, s. 12-15. ISSN: 1805-5044.
SZENDIUCH, I.; OTÁHAL, A.; PSOTA, B.; KLAPKA, M. Vibration Testing as a Tool to Optimize the Configuration of the PCBs. In IMAPS Proceedings. 1. San Diego, USA: IMAPS, 2014. p. 50-54. ISBN: 978-0-9909028-0-5.
OTÁHAL, A.; SZENDIUCH, I.; PSOTA, B. Mechanical testing of PCB using computer simulations. In 37th Int. Spring Seminar on Electronics Technology. Dresden: IEEE, 2014. č. 37, s. 290-293. ISBN: 978-1-4799-4455-2.
SZENDIUCH, I.; HEJÁTKOVÁ, E.; PSOTA, B.; OTÁHAL, A. EU Research programs - the Way to the Quality Increase of PhD Study. In ICEE/ICIT 2014. 1. Riga: iNNER, 2014. p. 26-31. ISBN: 9781479931927.
2013
OTÁHAL, A.; ADÁMEK, M.; JANSA, V.; SZENDIUCH, I. Investigation of the Mechanical Properties of Lead-Free Solder Materials. Key Engineering Materials (web), 2013, vol. 2013, iss. 592-593, p. 453-456. ISSN: 1662-9795.
SZENDIUCH, I.; KLAPKA, M.; PSOTA, B.; OTÁHAL, A. Importance of Vibration Testing for New Technological Solutions. In Proceedings EMPC 2013. 1. Grenoble: IMAPS France, 2013. iss. 1, p. 144-148. ISBN: 978-2-9527467-1-7.
OTÁHAL, A.; SZENDIUCH, I. Study of Atmosphere Influence on BGA Solder Balls Process. Conference proceedings (International Spring Seminar on Electronics Technology), 2013, vol. 36, iss. 2013, p. 121-126. ISSN: 2161-2528.
SZENDIUCH, I.; PSOTA, B.; OTÁHAL, A.; HEJÁTKOVÁ, E. Board on Board New PCB Configuration Moving in 3D Packaging. In THE INTERNATIONAL CONFERENCE - EDS, Brno 26 - 27 June 2013. Vysoké učení technické v Brně: Novapress sro, 2013. p. 224-227. ISBN: 978-80-214-4754-7.
*) Citace se generují jednou za 24 hodin.