Publication detail

Pulsed EM Plane-Wave Coupling to a Transmission Line Over Orthogonal Ground Planes: An Analytical Model Based on EM Reciprocity

ŠTUMPF, M.

Original Title

Pulsed EM Plane-Wave Coupling to a Transmission Line Over Orthogonal Ground Planes: An Analytical Model Based on EM Reciprocity

Type

journal article in Web of Science

Language

English

Original Abstract

Pulsed electromagnetic field coupling to a transmission line (TL) located over two mutually orthogonal, perfect ground planes is described analytically. It is demonstrated that the effect of an additional ground plane can be readily accounted for by extending the existing formulas applying to the configuration with the single ground plane. The thus obtained closed-form time-domain (TD) formulas specifying the equivalent Thévenin circuits at the terminals of the TL are subsequently applied to calculating the plane-wave induced voltage across a general terminal load. Some special (limiting) cases concerning a relatively short line located close to the conducting reference planes are discussed. The novel analytical results are validated with the help of a three-dimensional computational tool by analyzing the TD response of a thin, conducting planar strip above two mutually orthogonal reference planes.

Keywords

Electromagnetic coupling; electromagnetic interference; transmission line; time-domain analysis; thin strip; thin conducting planes.

Authors

ŠTUMPF, M.

Released

1. 2. 2021

Publisher

IEEE EMC Society

Location

Hoboken, NJ, USA

ISBN

1558-187X

Periodical

IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY

Year of study

63

Number

1

State

United States of America

Pages from

324

Pages to

327

Pages count

4

URL

https://ieeexplore.ieee.org/document/9067053

BibTex

@article{BUT164232,
  author="Martin {Štumpf}",
  title="Pulsed EM Plane-Wave Coupling to a Transmission Line Over Orthogonal Ground Planes: An Analytical Model Based on EM Reciprocity",
  journal="IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY",
  year="2021",
  volume="63",
  number="1",
  pages="324--327",
  doi="10.1109/TEMC.2020.2983049",
  issn="1558-187X",
  url="https://ieeexplore.ieee.org/document/9067053"
}