Publication detail

Design and simulation of solutions to reduce the thermal resistance of lighting systems

JANÁKOVÁ, I. HONEC, P. TULIS, V.

Original Title

Design and simulation of solutions to reduce the thermal resistance of lighting systems

Type

conference paper

Language

English

Original Abstract

The paper focuses on some essential steps in the development of high power line light. The research within the solved project deals with the development of a special extruded profile with a cooling channel and with heat removal by the circulation of the coolant and on the design of a cooling system with all the safety elements. The partial aim of the work is to determine the thermal resistance of individual parts of the device and to design modifications so that the total thermal resistance and maximum temperature are within the limits set by the effort to achieve maximum light output, but also the longevity, economy, safety, and reliability of operation. The analytical calculations, CFD simulations, and real testing were used to determine the required parameters. The main result presented in this paper is a novel developed PCB with a copper core and thermal vias. (C) 2019, IFAC (International Federation of Automatic Control) Hosting by Elsevier Ltd. All rights reserved.

Keywords

LED, line light source, line scan camera, computer vision, thermal resistance, light output, PCB, CFD simulation

Authors

JANÁKOVÁ, I.; HONEC, P.; TULIS, V.

Released

29. 10. 2019

Publisher

IFAC

ISBN

2405-8963

Periodical

IFAC-PapersOnLine (ELSEVIER)

Year of study

52

Number

27

State

Kingdom of the Netherlands

Pages from

446

Pages to

452

Pages count

7

URL

https://www.sciencedirect.com/science/article/pii/S2405896319326539

Full text in the Digital Library

http://hdl.handle.net/11012/184629

BibTex

@inproceedings{BUT160768,
  author="Ilona {Janáková} and Peter {Honec} and Vojtěch {Tulis}",
  title="Design and simulation of solutions to reduce the thermal resistance of lighting systems",
  booktitle="16th IFAC Conference on Programmable Devices and Embedded Systems PDeS 2019",
  year="2019",
  journal="IFAC-PapersOnLine (ELSEVIER)",
  volume="52",
  number="27",
  pages="446--452",
  publisher="IFAC",
  doi="10.1016/j.ifacol.2019.12.704",
  issn="2405-8963",
  url="https://www.sciencedirect.com/science/article/pii/S2405896319326539"
}