Design, synthesis and simulation of fractional-order element using MOS transistors as distributed resistive capacitive devices

Design, synthesis and simulation of fractional-order element using MOS transistors as distributed resistive capacitive devices

WoS Article

The article presents a synthesis method to design electrical circuit elements with fractional-order impedance, referred to as a Fractional-Order Element (FOE) or Fractor, that can be implemented by Metal-Oxide-Semiconductor (MOS) transistors. This provides an approach to realize this class of device using current integrated circuit manufacturing technologies. For this synthesis MOS transistors are treated as uniform distributed resistive-capacitive layer structures. The synthesis approach adopts a genetic algorithm to generate the MOS structures interconnections and dimensions to realize an FOE with user-defined constant input admittance phase, allowed ripple deviations, and target frequency range. A graphical user interface for the synthesis process is presented to support its wider adoption. We synthetized and present FOEs with admittance phase from 5 degrees to 85 degrees. The design approach is validated using Cadence post-layout simulations of an FOE design with admittance phase of 74 +/- 1 degrees realized using native n-channel MOS devices in TSMC 65 nm technology. Overall, the post-layout simulations demonstrate magnitude and phase errors less than 0.5% and 0.1 degrees, respectively, compared to the synthesis expected values in the frequency band from 1 kHz to 10 MHz. This supports that the design approach is appropriate for the future fabrication and validation of FOEs using this process technology.

The article presents a synthesis method to design electrical circuit elements with fractional-order impedance, referred to as a Fractional-Order Element (FOE) or Fractor, that can be implemented by Metal-Oxide-Semiconductor (MOS) transistors. This provides an approach to realize this class of device using current integrated circuit manufacturing technologies. For this synthesis MOS transistors are treated as uniform distributed resistive-capacitive layer structures. The synthesis approach adopts a genetic algorithm to generate the MOS structures interconnections and dimensions to realize an FOE with user-defined constant input admittance phase, allowed ripple deviations, and target frequency range. A graphical user interface for the synthesis process is presented to support its wider adoption. We synthetized and present FOEs with admittance phase from 5 degrees to 85 degrees. The design approach is validated using Cadence post-layout simulations of an FOE design with admittance phase of 74 +/- 1 degrees realized using native n-channel MOS devices in TSMC 65 nm technology. Overall, the post-layout simulations demonstrate magnitude and phase errors less than 0.5% and 0.1 degrees, respectively, compared to the synthesis expected values in the frequency band from 1 kHz to 10 MHz. This supports that the design approach is appropriate for the future fabrication and validation of FOEs using this process technology.

distributed element;fractional-order element;fractor;genetic algorithm;MOS transistor

distributed element;fractional-order element;fractor;genetic algorithm;MOS transistor

KUBÁNEK, D.; SHADRIN, A.; ŠEDA, P.; DVOŘÁK, J.; JEŘÁBEK, J.; KLEDROWETZ, V.; CHRISTIE, C.; FREEBORN, T.; USHAKOV, P.

27.04.2025

Springer Nature

2045-2322

Scientific Reports

15

4

United Kingdom of Great Britain and Northern Ireland

18

https://link.springer.com/article/10.1038/s41598-025-96539-w

http://hdl.handle.net/11012/251028

s41598-025-96539-w