Publication detail

Thermal conductivity of Cu7.2Ni1.8Si1Cr Copper alloy produced via SLM and ability of thin-wall structure fabrication

MAŠEK, J.

Original Title

Thermal conductivity of Cu7.2Ni1.8Si1Cr Copper alloy produced via SLM and ability of thin-wall structure fabrication

Type

lecture

Language

English

Original Abstract

Three parts - a disk with inner holes and two cylinders with thin-wall web of 0.325 mm and 1.625 mm - were produced by Selective laser melting technology from a copper alloy Cu7.2Ni1.8Si1Cr powder. Based on the previous experience with this copper material, the fabrication was successfully processed with up to 5 % dimensional accuracy according to CAD model. The fabricated samples were tested in an experimental thermo-vacuum chamber to reveal the material thermal conductivity since no data are freely available. Based on the reference samples testing, the evaluation process was upgraded by considering a heat transfer by radiation. The measured thermal conductivity of the SLM produced alloy Cu7.2Ni1.8Si1Cr was 3.4 times lower than the value of a bulk material AMPCOLOY 944 with a similar chemical composition.

Keywords

Additive manufacturing, SLM production accuracy, Copper alloy Cu7.2Ni1.8Si1Cr, Thin-wall structures, Thermal conductivity testing

Authors

MAŠEK, J.

Released

7. 11. 2018

Publisher

Brno University of Technology

Location

READ 2018, Brno, ČR

Pages count

10

BibTex

@misc{BUT151322,
  author="Jakub {Mašek}",
  title="Thermal conductivity of Cu7.2Ni1.8Si1Cr Copper alloy produced via SLM and ability of thin-wall structure fabrication",
  year="2018",
  pages="10",
  publisher="Brno University of Technology",
  address="READ 2018, Brno, ČR",
  doi="10.13164/conf.read.2018.12",
  note="lecture"
}